The joining of indium-tin-oxide (ITO) with ITO and Cu was achieved at 180°C in air using a newly developed active solder Sn56Bi4Ti(Ce, Ga). It is believed that the affinity of Ce for oxygen enabled the Ti to partition and to react with ITO and Cu at such temperatures near 180°C. Electron probe microanalyzer analysis elemental mapping revealed a strong tendency of Ti to segregate at the ITO/solder and solder/Cu interfaces. During soldering, Cu was found to dissolve and diffuse into Sn56Bi4Ti(Ce,Ga) solder forming scallop-shaped Cu6Sn5 intermetallic compounds. The bond shear strengths of Cu/Cu, ITO/ITO, and ITO/Cu joints were measured to be 8.7, 1.5, and 1.2 MPa, respectively. Fractography of the sheartested specimens showed that the Cu/Cu joint fractured along the Cu6Sn5 intermetallic layer, while ITO/Cu joint failure occurred in the ITO matrix.
- 晚風Lv 510 years agoFavorite Answer
氧化銦錫和銅的氧化銦錫焊接是在攝氏180度的空氣中使用新開發的活性焊錫Sn56Bi4Ti(Ce, Ga)完成的。據信鈰(Ce)對氧的親和力使得鈦能夠區分開來並且在這樣接近攝氏180度的溫度下與氧化銦錫及銅起反應。電子探頭微量分析儀的元素分布圖顯露出鈦在氧化銦錫/焊料以及焊料/銅的介面偏析的強烈趨勢。軟焊過程中，銅被發現分解並擴散進入Sn56Bi4Ti(Ce,Ga)焊料形成扇貝狀的Cu6Sn5金屬間化合物。銅/銅、氧化銦錫/氧化銦錫和氧化銦錫/銅焊點所測得的黏結剪強度分別是8.7, 1.5和1.2MPa。剪切試驗過試片的金屬斷面顯微鏡觀察證實銅/銅焊點沿著Cu6Sn5中間金屬層斷裂，然而氧化銦錫/銅焊接破裂發生在氧化銦錫基地。Source(s): Nightwind