pcb 面板翻譯~謝謝

請各位高手是否可以協助下以專業pcb翻譯 中翻英, 小弟將非常感激~謝謝

1.烤板4hr 後出現白點

2.內層鑽孔鍍銅後未換入樹塞流程,以1078的PP流膠量不足以將孔內

填滿,形成輕微缺膠之白點現象。

3.工程部已將內層鑽孔鍍銅位置增加樹塞填孔流程,來避免下次生產時再

發生此一現象。 修正後流程:鑽孔→鍍銅→樹塞→電鍍回填→外層線路

4.若內層有鑽孔無填孔時,需確認上下層PP流膠量考量,以免孔內無法填

滿形成缺膠。

5. 經品保於5/5確認確實已將所有資料消毀並重新提供

6.有關後續品質狀況,由品保針對異常改善對策進行全面性的監控以避免類

似的情形再度發生。

以上小弟專業知識不足,請問是否有專家可以幫忙翻譯, 謝謝

1 Answer

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  • 1 decade ago
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    1.烤板4hr 後出現白點:Baking sheet white spots after 4hr.

    2.內層鑽孔鍍銅後未換入樹塞流程,以1078的PP流膠量不足以將孔內

    填滿,形成輕微缺膠之白點現象。After drilling the inner layer copper process has not changed into the tree plug,in 1078 the PP flow glue is not enough to fill the hole,slight lack of gel formation of the phenomenon of white spots.

    3.工程部已將內層鑽孔鍍銅位置增加樹塞填孔流程,來避免下次生產時再

    發生此一現象。 修正後流程:鑽孔→鍍銅→樹塞→電鍍回填→外層線路 Engineering positions have increased copper inner tree plug hole filling process,Production has been to avoid the next recurrence of the same phenomenon,Revised process: drilling →Copper→Tree Plug→Plating backfill→Outer line.

    4.若內層有鑽孔無填孔時,需確認上下層PP流膠量考量,以免孔內無法填

    滿形成缺膠。If there are hole, but without filling the inner hole, we must confirm that the lower amount of PP plastic flow in order to avoid the hole can not fill the vacancy caused by rubber.

    5. 經品保於5/5確認確實已將所有資料消毀並重新提供 Quality Assurance in 2010.05.05 has confirmed the completion of, and destruction of all data and re-provide.

    6.有關後續品質狀況,由品保針對異常改善對策進行全面性的監控以避免類似的情形再度發生。Quality status on follow-up, Quality Control Department will make improvements for the anomaly, and carry out comprehensive monitoring to prevent similar situations from happening again.

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