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電路板上DIP零件,加上thermal 會造成吃鍚不良??

想請教一個問題,四層的電路板,如果在 top side 和 bot side 鋪銅(ground copper),只要是插件零件(DIP)是接ground,而且接ground 的那支腳產生thermal(花孔),該支腳就會很難吃鍚,需加上助銲劑.

如果把接ground 的那支腳在 top side 和 bot side 隔離不產生花孔,以內層來接通的話,就沒有這個問題產生,吃鍚也很正常,為什麼會這樣呢?

1 Answer

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  • 1 decade ago
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    在板子上的Ground Pad 因為是連接Ground 因為地也是大片的銅箔,所以散熱特快.你把 top side 和 bottom side 隔絕地,散熱沒有這麼快了,因為只剩下Ground 層的聯接.

    所以你會覺得很好上件.不過.通常只要恆溫烙鐵調高溫一點,點焊點久一點,都不會發生問題 .還有大量生產時,DIP元件都是過錫爐.不會有這種情況發生

    Source(s): 我是電子硬體工程師
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