品品 asked in 社會與文化語言 · 1 decade ago

請幫我翻譯下列有關半導體的問卷~10點

1.Incoming grinding

2.Number of bond-pad per die

3.Number of die per wafer

4.Number of bump per die

5.wafer是什麼材料?

6.Bond pad:

7.Bond pad passivation opening :

8.Product appleication:

9.IST Standard

10.Assigned by Customer

11.Assigned by IST

12.Redistridution layer

13.Oringinal bond pad locations:Please provide Excel file(x-ycoordinates)

14.Please provide mapping file(generated from IC foundey)

15.Bumppad allocation,if any:Please provide Excel file

16.High speed critical pin/nets:

17.Differentinalpairs:

1 Answer

Rating
  • Vic
    Lv 6
    1 decade ago
    Favorite Answer

    1.Incoming grinding --- 進料研磨

    2.Number of bond-pad per die --- 每顆晶粒的黏合接著金屬墊數量

    3.Number of die per wafer --- 每片晶圓的晶粒數量

    4.Number of bump per die --- 每顆晶粒的凸塊數量

    5.wafer是什麼材料? --- Silicon (矽)

    6.Bond pad: --- 黏合接著金屬墊

    7.Bond pad passivation opening : --- 黏合接著金屬墊的保護層開口

    8.Product appleication:--- 產品申請書

    9.IST Standard --- Information Service and Technology標準

    10.Assigned by Customer --- 客戶所指定的

    11.Assigned by IST --- IST所指定的

    12.Redistridution layer --- 重新分配層 (一種重新分配黏合接著金屬墊的位置的技術)

    13.Oringinal bond pad locations:Please provide Excel file(x-ycoordinates) --- 原始的黏合接著金屬墊的位置:請提供Excel檔案(x-y座標)

    14.Please provide mapping file(generated from IC foundey) --- 請提供mapping檔(由IC晶圓廠所產生的)

    15.Bumppad allocation,if any:Please provide Excel file --- 凸塊金屬墊配置,假如有的話:請提供Excel檔案

    16.High speed critical pin/nets: --- 高速關鍵探針/網絡

    17.Differentinalpairs: --- ???

    2007-10-23 18:06:43 補充:

    更正:

    bond-pad 應該翻成銲墊

    Source(s): 有相關經驗的人
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